Optimization of the Copper Plating Process Using the …
Copper electroplating formulas composed of CuSO 4, H 2 SO 4, chloride ions, polyethylene glycol (PEG), bis (3-sulfopropyl) disulfide (SPS), and different levelers for microvia filling of a printed circuit board (PCB) were studied.The influence of the copper electroplating parameters, accelerator and leveler concentrations and cathodic current …